Technical Details

Model： HiBy RS8 II
 
Operating System
Android 13
CPU
Qualcomm Dragonwing QCS8550 (same platform as Snapdragon 8 Gen 2)
DAC
DARWIN III
Audio Format Support
DSD1024, PCM1536kHz/32bit, MQA16X
Analogue Audio Ports
3.5mm PO/L0 (shared),4.4mm balanced,4.4mm balanced line out
Digital Audio Ports
I2S,USB-C (SPDIF, USB Audio In, USB Audio Out)
Audio Codec Support
mp3, wav, ape, flac, dsf, dff, iso, cue, wma, ogg, aac, opus, aiff
WiFi
Wi-Fi7 MIMO (802.11be)
Bluetooth
Bluetooth 5.3 (bidirectional)
Display Size
5.5"
Resolution
1080 x 1920
RAM
16GB (LPDDR5-4200MHz)
Internal Storage
512GB
USB Port
USB-C supporting USB 2, 3, 3.2 gen 2, max bandwidth 10Gbps
Micro SD Support
Supports up to 2TB (supports hot plugging)
Colors
Starlight Golden, Classic Black
Body Material
Aerospace-grade aluminum chassis with glass backplate
Dimensions
75.7 x 148.5 x 24.1 mm
Weight
411g
Inside the Box
  • RS8 II device proper x1
  • Leather case x1
  • Type C to Type C charging cable (USB 3.0) x1
  • Tempered glass protector x1
  • Dust plug x1
  • User guide (User manual/Warranty card/QC Certificate) x1
  • Outer packaging x1

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